ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE

An electronic component package 1 is provided with an electronic component 10 and a sealing resin 20 that seals the periphery of the electronic component 10. With respect to this electronic component package 1, one main surface of the sealing resin 20 forms a mounting surface 21 that mounts the elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOSHIMORI, Hiroki, NAKAGOSHI, Hideo, TAKAKURA, Tsuyoshi, NAKAMURA, Takamitsu, KINO, Daisuke
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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