HEAT DISSIPATION PLATE, ELECTRONIC ASSEMBLY, AND TERMINAL

Provided are a heat dissipation plate, an electronic assembly, and a terminal. The heat dissipation plate has a fluid inlet, and a cavity, in which a refrigerant fluid flows after same enters the heat dissipation plate. The cavity comprises a slow flow region and a main heat dissipation region, wherein the fluid inlet is in communication with the slow flow region, the slow flow region is in communication with the main heat dissipation region, and the refrigerant fluid sequentially flows through the fluid inlet, the slow flow region and the main heat dissipation region. When the refrigerant fluid flows to the slow flow region and then flows out of the slow flow region through a fluid flow opening of same, the flow velocity of the refrigerant fluid decreases, and the flow rate tends to be stable. The scouring of the main heat dissipation region by the refrigerant fluid is relatively small, so that there is relatively little scouring corrosion of the main heat dissipation region, thereby facilitating the extensi