OPTIONAL MODULE HEAT DISSIPATION APPARATUS AND COMMUNICATION DEVICE

An optical module heat dissipation apparatus and a communication device, wherein the optical module heat dissipation apparatus comprises: a circuit board (11) used for placing an optical module guide rail (20), a heat dissipation structure (12), a mounting structure (13), and a fixed support structu...

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Bibliographische Detailangaben
Hauptverfasser:	XIAO, Kaiyuan, WEI, Chuanda
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An optical module heat dissipation apparatus and a communication device, wherein the optical module heat dissipation apparatus comprises: a circuit board (11) used for placing an optical module guide rail (20), a heat dissipation structure (12), a mounting structure (13), and a fixed support structure (14). The heat dissipation structure (12) comprises a heat sink (121) and a heat-conducting medium (122) attached to the side of the heat sink (121) close to the circuit board (11). The mounting structure (13) rotatably connects the heat sink (121) to the circuit board (11), and the fixing support structure (14) fixes the heat sink (121) and the circuit board (11) to compress the heat-conducting medium (122). According to the optical module heat dissipation apparatus and the communication device, the heat dissipation apparatus can be mounted when ports on a panel side are arranged in high density, thereby meeting the heat dissipation requirement of a space having a small heat dissipation height. L'invention conc