COMPONENT PLACEMENT SYSTEMS, MULTI-PIPETTE PLACEMENT HEADS, AND METHODS OF USING THE SAME

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of control...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BREWEL, Roy, VAN DER BURG, Richard Adrianus Johannes
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes. L'invention concerne un système de placement de composants. Le système de placement de composants comprend une tête de placement comprenant une pluralité de pipettes. Chacune de la pluralité de pipettes est conçue pour prélever et placer des composants. La tête de placement comprend une pluralité de dispositifs de commande, chacun de la pluralité de dispositifs de commande étant conçu pour commander une pipette respective parmi la pluralité de pipettes.