PACKAGING STRUCTURE AND METHOD FOR LASER DIODE DIE, AND RANGING APPARATUS AND MOVABLE PLATFORM

PACKAGING STRUCTURE AND METHOD FOR LASER DIODE DIE, AND RANGING APPARATUS AND MOVABLE PLATFORM

A packaging structure and method for a laser diode die, and a ranging apparatus and a movable platform. The packaging structure (300) comprises: a substrate (310), which comprises a first surface and a second surface opposite the first surface; a laser diode die (320), which comprises a light-emitti...

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Hauptverfasser: LUO, Feiyu, WANG, Guocai, ZHENG, Guoguang, LIU, Xiang
Format: Patent
Sprache:chi ; eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LUO, Feiyu
WANG, Guocai
ZHENG, Guoguang
LIU, Xiang
description A packaging structure and method for a laser diode die, and a ranging apparatus and a movable platform. The packaging structure (300) comprises: a substrate (310), which comprises a first surface and a second surface opposite the first surface; a laser diode die (320), which comprises a light-emitting area for emitting light, and is arranged on the first surface of the substrate (310); a reflection member (370), which is arranged on the first surface of the substrate (310), is arranged adjacent to the laser diode die (320) and is used for reflecting the light emitted from the light-emitting area and then emitting same; a first package (350), which at least covers the laser diode die (320) and the reflection member (370), wherein the first package (350) is made of a transparent insulating material; and a second package (360), which is located on the first surface of the substrate (310), wherein the second package (360) abuts against at least part of an edge of the first package (350), and the second package (3
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PACKAGING STRUCTURE AND METHOD FOR LASER DIODE DIE, AND RANGING APPARATUS AND MOVABLE PLATFORM
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