PACKAGING STRUCTURE AND METHOD FOR LASER DIODE DIE, AND RANGING APPARATUS AND MOVABLE PLATFORM

A packaging structure and method for a laser diode die, and a ranging apparatus and a movable platform. The packaging structure (300) comprises: a substrate (310), which comprises a first surface and a second surface opposite the first surface; a laser diode die (320), which comprises a light-emitti...

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Bibliographische Detailangaben
Hauptverfasser:	LUO, Feiyu, WANG, Guocai, ZHENG, Guoguang, LIU, Xiang
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A packaging structure and method for a laser diode die, and a ranging apparatus and a movable platform. The packaging structure (300) comprises: a substrate (310), which comprises a first surface and a second surface opposite the first surface; a laser diode die (320), which comprises a light-emitting area for emitting light, and is arranged on the first surface of the substrate (310); a reflection member (370), which is arranged on the first surface of the substrate (310), is arranged adjacent to the laser diode die (320) and is used for reflecting the light emitted from the light-emitting area and then emitting same; a first package (350), which at least covers the laser diode die (320) and the reflection member (370), wherein the first package (350) is made of a transparent insulating material; and a second package (360), which is located on the first surface of the substrate (310), wherein the second package (360) abuts against at least part of an edge of the first package (350), and the second package (3