LIGHT-EMITTING DIODE PACKAGING STRUCTURE, DISPLAY PANEL, AND TILED DISPLAY APPARATUS

Embodiments of the present invention disclose a light-emitting diode packaging structure, a display panel, and a tiled display apparatus The light-emitting diode packaging structure comprises: a packaging bottom layer, multiple light-emitting units, and an upper packaging layer. The packaging bottom...

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Bibliographische Detailangaben
Hauptverfasser: HSU, Chenke, FAN, Yong, XIE, Xiangwei
Format: Patent
Sprache:chi ; eng ; fre
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Zusammenfassung:Embodiments of the present invention disclose a light-emitting diode packaging structure, a display panel, and a tiled display apparatus The light-emitting diode packaging structure comprises: a packaging bottom layer, multiple light-emitting units, and an upper packaging layer. The packaging bottom layer is provided with multiple welding pads, which can be used for being joined with subsequent driving substrate lines; the multiple light-emitting units are light-emitting diode chips; the light-emitting diode packaging structure is provided with a first edge and a second edge opposite the first edge, and the distance from the first edge to the central point position of the light-emitting unit closest to the first edge among the multiple light-emitting units is not equal to the distance from the second edge to the central point position of the light-emitting unit closest to the second edge among the multiple light-emitting units. In the embodiments of the present invention, the light-emitting diode packaging st