CAMERA MODULE FOR HEAT DISSIPATION AND GROUNDING, AND ELECTRONIC DEVICE COMPRISING SAME

A camera module according to an embodiment includes a printed circuit board including a conductive pad exposed on one surface thereof, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHO, Wonchul, CHOI, Kwangsic, KIM, Taeyun, CHO, Minki, AHN, Dohyun, JEONG, Wonjun, KIM, Jungsoo, HEO, Chonguk
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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