PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A CAP SUBSTRATE COMPRISING AN INDUCTOR

A package (100) that includes an acoustic device, a frame (105) coupled to the acoustic device and a cap substrate (104) coupled to the acoustic device through the frame. The acoustic device includes a substrate (120) and an acoustic element (121) coupled to the substrate. The cap substrate includes...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAGN, Peter, KRAVCHENKO, Roman, HOFER, Manuel, WIESBAUER, Kurt, BRUNNER, Sebastian, HATZL, Stefan Leopold, FAULHABER, Horst Uwe, RAK, Florian
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
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