PLASMA POWDER DEPOSITION APPARATUS AND DEPOSITION METHOD USING SAME

The present invention relates to a plasma powder deposition apparatus and a deposition method using same, and specifically to: a plasma powder deposition apparatus which is provided in plurality so that the surfaces of powder particles are melted by plasma and the spray angle of the powder particles...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Mun Ki, SEOK, Hye Won, CHOI, Boo Hyun, LEE, Kyung Min, KIM, Dae Gun
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a plasma powder deposition apparatus and a deposition method using same, and specifically to: a plasma powder deposition apparatus which is provided in plurality so that the surfaces of powder particles are melted by plasma and the spray angle of the powder particles is adjusted or varied, thus improving the deposition rate and the density of a deposition layer and relieving stress while improving the thickness of the deposition layer, and also improving the uniformity of the coating thickness on a substrate; and a deposition method using same. La présente invention concerne un appareil de dépôt de poudre par plasma et un procédé de dépôt l'utilisant, et spécifiquement : un appareil de dépôt de poudre par plasma qui est fourni en pluralité de sorte que les surfaces des particules de poudre sont fondues par plasma et l'angle de pulvérisation des particules de poudre est ajusté ou modifié, améliorant ainsi le taux de dépôt et la densité d'une couche de dépôt et réduisant la contrainte tout en améliorant l'épaisseur de la couche de dépôt, et améliorant également l'uniformité de l'épaisseur de revêtement sur un substrat. L'invention concerne également un procédé de dépôt l'utilisant. 본 발명은 플라즈마 분말 증착 장치 및 그를 이용한 증착 방법에 관한 것으로, 구체적으로 플라즈마로 분말 입자 표면이 용융되고 상기 분말 입자의 분사각이 조절되거나 분사각을 달리하도록 복수 개로 구비되도록 구현함으로써, 증착 속도 및 증착층의 치밀도를 향상시키고 응력을 해소하는 동시에 증착층의 두께를 향상시키며, 기재 상의 코팅 두께의 균일도를 향상시키는 플라즈마 분말 증착 장치 및 그를 이용한 증착 방법에 관한 것이다.