SUBSTRATE PROCESSING APPARATUS

The present invention relates to a substrate processing apparatus comprising: a chamber; a substrate support part which supports at least one substrate in the chamber; a lower plate which is disposed above the substrate support part; and an upper plate which is disposed above the lower plate, wherei...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHA, Sang Yun, JANG, Dae Soo, KIM, Jun Young, LEE, Ji Hun
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!