MULTI-LAYERED COMPOSITE FOR EMI SHIELDING

A multi-layered composite comprising a substrate and a conductive film is provided. The substrate contains a polymer composition that contains a thermoplastic polymer having a deflection temperature under load of about 40°C or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa....

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Bibliographische Detailangaben
Hauptverfasser:	YANG, Young-Chul, BANSAL, Prabuddha, CHOI, SooHee, SUBRAMONIAN, Suresh
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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