SOLUBLE POLYIMIDES FOR COATING ON POLYMERIC SUBSTRATES

A composition comprising 5-30 weight percent of a polyimide and a solvent having boiling point of less than 150°C, and optionally further comprising a pigment, where the polyimide is soluble in the solvent and is the dehydrated reaction product of a dianhydride component and a diamine component. A m...

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Bibliographische Detailangaben
Hauptverfasser:	SUMMERS, John Donald, ROBERTS, C. Chad, LI, Wei
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEPARATION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A composition comprising 5-30 weight percent of a polyimide and a solvent having boiling point of less than 150°C, and optionally further comprising a pigment, where the polyimide is soluble in the solvent and is the dehydrated reaction product of a dianhydride component and a diamine component. A method of coating the composition on a substrate comprising a flexible polymer. L'invention concerne une composition comprenant de 5 à 30 pour cent en poids d'un polyimide et d'un solvant ayant un point d'ébullition inférieur à 150 °C, et comprenant éventuellement en outre un pigment, le polyimide étant soluble dans le solvant et étant le produit de réaction déshydraté d'un constituant dianhydride et d'un constituant diamine. L'invention concerne un procédé de revêtement de la composition sur un substrat comprenant un polymère souple.