METHOD FOR MANUFACTURING STEP-SHAPED LIGHTING DEVICE BY USING BENDABLE PRINTED CIRCUIT BOARD

According to an embodiment of the present invention, a method for manufacturing a lighting device using a bendable printed circuit board (PCB), which is performed by a lighting device manufacturing system, comprises: a PCB bending step of transferring a PCB to a preset step-shaped bending jig and th...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Yong Sung, LEE, Myon Yong, CHOI, Jae Hwan, KIM, Byeong Gu
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	According to an embodiment of the present invention, a method for manufacturing a lighting device using a bendable printed circuit board (PCB), which is performed by a lighting device manufacturing system, comprises: a PCB bending step of transferring a PCB to a preset step-shaped bending jig and then arranging the PCB along the surface of the bending jig to bend the PCB into a stepped shape; a PCB pickup step of picking up the bent PCB and transferring the picked-up PCB to a backplate including the same shape as the stepped shape; and a PCB assembly step of assembling the bent PCB to the backplate, wherein the PCB is a band-shaped substrate in which a plurality of light-emitting devices are mounted to be spaced apart from each other at a predetermined interval. Selon un mode de réalisation, la présente invention concerne un procédé de fabrication d'un dispositif d'éclairage utilisant une carte de circuit imprimé pliable (PCB), qui est mis en oeuvre par un système de fabrication de dispositif d'éclairage et comprend : une étape de pliage de PCB consistant à transférer une PCB vers un gabarit de pliage prédéfini en forme de marche d'escalier, et à agencer ensuite la PCB le long de la surface du gabarit de pliage pour plier la PCB en forme de marche d'escalier; une étape de saisie de PCB consistant à saisir la PCB pliée et à transférer la PCB saisie vers une plaque arrière présentant la même forme que les marches d'escalier; et une étape d'assemblage de PCB consistant à assembler la PCB pliée à la plaque arrière, la PCB étant un substrat en forme de bande dans lequel une pluralité de dispositifs électroluminescents sont montés de façon espacée les uns par rapport aux autres selon un intervalle prédéfini. 본 발명의 일 실시예에 따르는, 조명장치 제조시스템에 의해 수행되는, 벤딩(Bending) 가능한 PCB(Printed Circuit Board)를 이용한 조명장치 제조방법은, PCB를 기 설정된 계단 형상의 벤딩용 지그(Jig)로 이송한 후, 상기 PCB를 상기 벤딩용 지그의 표면을 따라 배치시킴으로써, 상기 PCB를 상기 계단 형상으로 벤딩하는, PCB벤딩 단계; 상기 벤딩된 PCB를 픽업하여 상기 계단 형상과 동일한 형상을 포함하는 백플레이트(backplate)로 이송하는 PCB픽업 단계; 및 상기 벤딩된 PCB를 상기 백플레이트에 조립하는, PCB조립 단계;를 포함하되, 상기 PCB는 복수의 발광소자가 기 설정된 간격을 가지고 이격되어 실장되는 띠 형상의 기판인 것이다.