PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES

A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of asperities. The CMP composition comprises abrasives, polyuretha...

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Bibliographische Detailangaben
Hauptverfasser:	SCHLUETER, James Allen, PHILIPOSSIAN, Ara, O'NEILL, Mark Leonard, SAMPURNO, Yasa, SHI, Xiaobo, VACASSY, Robert, LANGAN, John G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of asperities. The CMP composition comprises abrasives, polyurethane beads, and surfactant. The polishing pad lifetime increasing is achieved using PIB-type Cu barrier CMP polishing composition. Une nouvelle technologie de tampon en bouteille (PIB) destinée à des compositions, systèmes et procédés CMP avancées de barrière au cuivre de planarisation chimico-mécanique (CMP) a été divulguée en vue d'une utilisation avec des tampons de polissage à base de polyuréthane présentant une pluralité d'aspérités. La composition CMP comprend des abrasifs, des billes de polyuréthane et un tensioactif. L'augmentation de la durée de vie du tampon de polissage est obtenue à l'aide d'une composition de polissage CMP de barrière au Cu de type PIB.