LOW THERMAL CONDUCTIVITY METAL INSERT WITH SURFACE MICROSTRUCTURES

A mold insert includes a plurality of microstructures along a surface of the mold insert and a metal alloy, wherein the metal alloy has a thermal conductivity between 1 and 50 W/m-K, and wherein the metal alloy has a modulus of between 100 GPa and 1000 GPa. Un insert de moule comprend une pluralité...

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Bibliographische Detailangaben
1. Verfasser:	CHIU, Hao-Wen
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A mold insert includes a plurality of microstructures along a surface of the mold insert and a metal alloy, wherein the metal alloy has a thermal conductivity between 1 and 50 W/m-K, and wherein the metal alloy has a modulus of between 100 GPa and 1000 GPa. Un insert de moule comprend une pluralité de microstructures sur une surface de l'insert de moule et un alliage métallique, l'alliage métallique ayant une conductivité thermique comprise entre 1 et 50 W/m-K, et l'alliage métallique ayant un module compris entre 100 GPa et 1000 GPa.