CIRCUIT BOARD, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR CIRCUIT BOARD

Provided in the present application are a circuit board, an electronic device, and a production method for the circuit board. The circuit board comprises: a board body; an electronic element, which is welded on a surface of the board body by means of soldering; and reaction particles which are arranged on the surface of the board body and are adjacent to a welding pin for welding the electronic element. When the circuit board is charged and in a water environment, the reaction particles react with the welding pin to form an insoluble substance protective layer on an outer surface of the welding pin, such that the insoluble substance protective layer isolates the welding pin from coming into contact with water, so as to prevent dendrite corrosion of the welding pin. In the solution provided in the embodiments of the present application, dendrite corrosion of the circuit board can be prevented, and the arrangement of the reaction particles is not prone to limitation by a geometric shape of the circuit board; th