SOLDER PASTE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

A solder paste according to the present invention contains a flux composition and a solder powder and is configured such that, with respect to a flux residue that is obtained from this solder paste in accordance with a specific production procedure, if G'100 is the storage elastic modulus there...

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Bibliographische Detailangaben
Hauptverfasser:	ASAMI Ai, SAKUMA Haruya, YOSHIDA Hisahiko, TAKAKI Akiko
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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