THREE-DIMENSIONAL WIRING CIRCUIT BOARD STRUCTURE

An embodiment of the present invention provides a three-dimensional wiring circuit board structure. The three-dimensional wiring circuit board structure comprises: a bottom board, the bottom board having a first groove and a first pin thereon; a function board, the function board having a second pin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG, Tielong, LIANG, Zhiming
Format: Patent
Sprache:chi ; eng ; fre
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Beschreibung
Zusammenfassung:An embodiment of the present invention provides a three-dimensional wiring circuit board structure. The three-dimensional wiring circuit board structure comprises: a bottom board, the bottom board having a first groove and a first pin thereon; a function board, the function board having a second pin and a third pin thereon; and a bridge board, the bridge board having a second groove and a fourth pin thereon. The bottom of the function board is inserted into the second groove and the second pin is connected to the fourth pin, so as to form a combined function module; the combined function module is inserted into the first groove, and the third pin is connected to the first pin. Forming a combined function module by means of a bridge board and a function board, and arranging the combined function module on a bottom board, not only improves the space utilization efficiency and increases connection pins of the bottom board to the function board, but also increases circuit wiring space of the function board and la