POLISHING PADS WITH INTERCONNECTED PORES
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post inclu...
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| creator | FUNG, Jason G WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath KAKIREDDY, Veera Raghava Reddy JAWALI, Puneet Narendra CHOCKALINGAM, Ashwin BARADANAHALLI KENCHAPPA, Nandan BAJAJ, Rajeev |
| description | Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.
Des modes de réalisation, de manière générale, se rapportent à des tampons de polissage et à des procédés de formation de tampons de polissage. Un tampon de polissage comprend une pluralité d'éléments de polissage et une pluralité de rainures disposées entre les éléments de polissage. Chaque élément de polissage comprend une pluralité de montants individuels. Chaque montant comprend une surface individuelle qui forme une partie d'une surface de polissage du tampon de polissage et une ou plusieurs parois latérales s'étendant vers le bas à partir de la surface individuelle. Les parois latérales de la pluralité de montants individuels définissent une pluralité de pores disposés entre les montants. |
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Des modes de réalisation, de manière générale, se rapportent à des tampons de polissage et à des procédés de formation de tampons de polissage. Un tampon de polissage comprend une pluralité d'éléments de polissage et une pluralité de rainures disposées entre les éléments de polissage. Chaque élément de polissage comprend une pluralité de montants individuels. Chaque montant comprend une surface individuelle qui forme une partie d'une surface de polissage du tampon de polissage et une ou plusieurs parois latérales s'étendant vers le bas à partir de la surface individuelle. Les parois latérales de la pluralité de montants individuels définissent une pluralité de pores disposés entre les montants.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230615&DB=EPODOC&CC=WO&NR=2022265826A8$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230615&DB=EPODOC&CC=WO&NR=2022265826A8$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUNG, Jason G</creatorcontrib><creatorcontrib>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath</creatorcontrib><creatorcontrib>KAKIREDDY, Veera Raghava Reddy</creatorcontrib><creatorcontrib>JAWALI, Puneet Narendra</creatorcontrib><creatorcontrib>CHOCKALINGAM, Ashwin</creatorcontrib><creatorcontrib>BARADANAHALLI KENCHAPPA, Nandan</creatorcontrib><creatorcontrib>BAJAJ, Rajeev</creatorcontrib><title>POLISHING PADS WITH INTERCONNECTED PORES</title><description>Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.
Des modes de réalisation, de manière générale, se rapportent à des tampons de polissage et à des procédés de formation de tampons de polissage. Un tampon de polissage comprend une pluralité d'éléments de polissage et une pluralité de rainures disposées entre les éléments de polissage. Chaque élément de polissage comprend une pluralité de montants individuels. Chaque montant comprend une surface individuelle qui forme une partie d'une surface de polissage du tampon de polissage et une ou plusieurs parois latérales s'étendant vers le bas à partir de la surface individuelle. Les parois latérales de la pluralité de montants individuels définissent une pluralité de pores disposés entre les montants.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAI8PfxDPbw9HNXCHB0CVYI9wzxUPD0C3ENcvb383N1DnF1UQjwD3IN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGRkZmphZGZo4WxsSpAgCtfiVC</recordid><startdate>20230615</startdate><enddate>20230615</enddate><creator>FUNG, Jason G</creator><creator>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath</creator><creator>KAKIREDDY, Veera Raghava Reddy</creator><creator>JAWALI, Puneet Narendra</creator><creator>CHOCKALINGAM, Ashwin</creator><creator>BARADANAHALLI KENCHAPPA, Nandan</creator><creator>BAJAJ, Rajeev</creator><scope>EVB</scope></search><sort><creationdate>20230615</creationdate><title>POLISHING PADS WITH INTERCONNECTED PORES</title><author>FUNG, Jason G ; WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath ; KAKIREDDY, Veera Raghava Reddy ; JAWALI, Puneet Narendra ; CHOCKALINGAM, Ashwin ; BARADANAHALLI KENCHAPPA, Nandan ; BAJAJ, Rajeev</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022265826A83</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUNG, Jason G</creatorcontrib><creatorcontrib>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath</creatorcontrib><creatorcontrib>KAKIREDDY, Veera Raghava Reddy</creatorcontrib><creatorcontrib>JAWALI, Puneet Narendra</creatorcontrib><creatorcontrib>CHOCKALINGAM, Ashwin</creatorcontrib><creatorcontrib>BARADANAHALLI KENCHAPPA, Nandan</creatorcontrib><creatorcontrib>BAJAJ, Rajeev</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUNG, Jason G</au><au>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath</au><au>KAKIREDDY, Veera Raghava Reddy</au><au>JAWALI, Puneet Narendra</au><au>CHOCKALINGAM, Ashwin</au><au>BARADANAHALLI KENCHAPPA, Nandan</au><au>BAJAJ, Rajeev</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PADS WITH INTERCONNECTED PORES</title><date>2023-06-15</date><risdate>2023</risdate><abstract>Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.
Des modes de réalisation, de manière générale, se rapportent à des tampons de polissage et à des procédés de formation de tampons de polissage. Un tampon de polissage comprend une pluralité d'éléments de polissage et une pluralité de rainures disposées entre les éléments de polissage. Chaque élément de polissage comprend une pluralité de montants individuels. Chaque montant comprend une surface individuelle qui forme une partie d'une surface de polissage du tampon de polissage et une ou plusieurs parois latérales s'étendant vers le bas à partir de la surface individuelle. Les parois latérales de la pluralité de montants individuels définissent une pluralité de pores disposés entre les montants.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POLISHING PADS WITH INTERCONNECTED PORES |
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