TRANSPARENT MEMBER, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR THERMOFORMING TRANSPARENT MEMBER

A method for forming a transparent member according to an embodiment may comprise the steps of: inserting a first transparent substrate and a second transparent substrate into a first cavity and a second cavity of a lower mold, respectively, the first cavity having a first depth, the second cavity h...

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Bibliographische Detailangaben
Hauptverfasser:	AN, Sangung, KIM, Juree, KIM, Junseok, LEE, Hosoon, CHOI, Hyunsuk, JANG, Jongcheol
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	CHEMISTRY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A method for forming a transparent member according to an embodiment may comprise the steps of: inserting a first transparent substrate and a second transparent substrate into a first cavity and a second cavity of a lower mold, respectively, the first cavity having a first depth, the second cavity having a second depth and being connected to the first cavity; placing an upper mold above the lower mold, the upper mold corresponding to the lower mold and comprising a pressing part having at least one pressing surface; pre-heating at least one of the upper mold or the lower mold in which the transparent substrates are placed to a predetermined temperature; and pressing the upper mold to press the pre-heated transparent substrate, thereby thermoforming the substrate. Various other embodiments identified through the disclosure are possible. Un procédé de formation d'un élément transparent selon un mode de réalisation peut comprendre les étapes consistant à : insérer un premier substrat transparent et un second substrat transparent dans une première cavité et une seconde cavité d'un moule inférieur, respectivement, la première cavité ayant une première profondeur, la seconde cavité ayant une seconde profondeur et étant reliée à la première cavité ; placer un moule supérieur au-dessus du moule inférieur, le moule supérieur correspondant au moule inférieur et comprenant une partie de compression ayant au moins une surface de compression ; préchauffer à une température prédéterminée le moule supérieur ou le moule inférieur dans lequel les substrats transparents sont placés ; et compresser le moule supérieur pour compresser le substrat transparent préchauffé, ce qui permet de thermoformer le substrat. Divers autres modes de réalisation identifiés dans la divulgation sont possibles. 일 실시 예에 따른 투명 부재의 성형 방법은, 하부 금형의 제1 깊이를 가지는 제1 캐비티(cavity) 및 제1 캐비티와 연결되고 제2 깊이를 가지는 제2 캐비티 각각에 제1 투명 기판 및 제2 투명 기판을 투입하는 공정, 하부 금형의 상부에 하부 금형과 대응되고 적어도 하나의 가압면을 가지는 가압부를 포함하는 상부 금형을 배치하는 공정, 투명 기판이 배치된 하부 금형 또는 상부 금형 중 적어도 하나를 일정 온도로 예열시키는 공정 및 예열된 투명 기판을 상부 금형을 가압하는 방식으로 가압하여 열 성형하는 공정을 포함할 수 있다. 이 외에도 명세서를 통해 파악되는 다양한 실시 예가 가능하다.