CONDUCTIVE BRIDGE BETWEEN CHIPS, FABRICATION METHOD THEREFOR, AND CHIP TESTING METHOD

The present invention provides a conductive bridge between chips, a fabrication method therefor, and a chip testing method. An opening may be formed by etching in at least one layer of a layer to be etched in a bridge region and a bridge deck structure. When a photoresist is coated and developed, the opening may ensure that the photoresist on the top surface of the bridge deck structure is effectively retained at a suitable thickness and width and a good shape (because the opening may prevent the photoresist therein from being thrown out). Then, when a photoresist layer is used as a mask to etch the layer to be etched to form a conductive bridge, the photoresist may effectively protect the bridge deck structure and the layer to be etched on the top surface thereof. Therefore, the required shape and width of the conductive bridge and a reliable performance are achieved, and short-circuit and open-circuit conditions of the formed conductive bridge are avoided, thereby reducing the phenomenon of misdetermination