ELASTIC ASSEMBLY, HEAT DISSIPATION APPARATUS, ELECTRONIC DEVICE, CIRCUIT MODULE, AND ASSEMBLY METHOD THEREFOR

The present application relates to the technical field of communications, and discloses an anti-shedding elastic assembly, a heat dissipation apparatus, an electronic device, a circuit module, and an assembly method therefor. After the mounting of a connecting component and a fastening component in the anti-shedding elastic assembly is completed, an anti-shedding spacing for preventing a second member from being shed with respect to a first member can be formed by means of a screw body, an elastic element and an anti-shedding member in the connecting component; second, a fixed spacing for fixing the second member to the third member can be formed by means of the screw body and the fastening component in the connecting component; and finally, an elastic spacing for elastically bonding the first member to the second member, i.e., elastically bonding the first member to the third member can be formed by connecting the screw body, the elastic element and the fastening component in the connecting component. When t