PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner regio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KRISHNAMURTHY, Srikanth, XU, Ming, PARKHE, Vijay, OKADA, Ashley M, GUNTURI, Ramachandra Murthy
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CONTROLLING MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME PHYSICS REGULATING SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES TESTING
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