CIRCUIT BOARD, CHIP ON FILM, DISPLAY DEVICE, AND BONDING METHOD

The present disclosure provides a circuit board, a chip on film, a display device, and a bonding method. The circuit board is provided with a plurality of bonding areas for allowing to bond to the chip on film. Each bonding area comprises: a plurality of first pins extending in a first direction and...

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Bibliographische Detailangaben
Hauptverfasser:	LI, Qing, QUAN, Yu, LIANG, Yunyun, LIU, Jiantao, CHEN, Yunlu, HE, Liu, PAN, Zhengru, WANG, Jun, SUN, Jianwei, HUANG, Yanting, LIU, Changcheng, ZHOU, Liugang
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The present disclosure provides a circuit board, a chip on film, a display device, and a bonding method. The circuit board is provided with a plurality of bonding areas for allowing to bond to the chip on film. Each bonding area comprises: a plurality of first pins extending in a first direction and sequentially arranged in a second direction; and at least one first alignment mark group located on an arrangement path of the first pin and configured to be in snap-in alignment with a second alignment mark group of the chip on film, so that the first pins are bonded and attached to the second pins of the chip on film in a one-to-one correspondence manner. La présente divulgation concerne une carte de circuit imprimé, une puce sur film, un dispositif d'affichage et un procédé de liaison. La carte de circuit imprimé est pourvue d'une pluralité de zones de liaison pour permettre une liaison à la puce sur film. Chaque zone de liaison comprend : une pluralité de premières broches s'étendant dans une première directio