THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCTS USING SAME

Provided is a thermoplastic resin composition comprising: (C) 3 to 10 parts by weight of a polyether-ester-amide block copolymer; and (D) 1 to 10 parts by weight of an ethylene-alpha-olefin copolymer, based on 100 parts by weight of a base material comprising (A) 40 to 70 wt% of polyamide resin and...

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Bibliographische Detailangaben
Hauptverfasser:	HONG, Sanghyun, KIM, Hanna, JIN, Youngsub, CHOI, Wonyoung, BAE, Yunseok, SONG, Bongjun
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a thermoplastic resin composition comprising: (C) 3 to 10 parts by weight of a polyether-ester-amide block copolymer; and (D) 1 to 10 parts by weight of an ethylene-alpha-olefin copolymer, based on 100 parts by weight of a base material comprising (A) 40 to 70 wt% of polyamide resin and (B) 30 to 60 wt% of an inorganic filler including glass fibers. L'invention concerne une composition de résine thermoplastique comprenant : (C) 3 à 10 parties en poids d'un copolymère séquencé polyéther-ester-amide; et (D) 1 à 10 parties en poids d'un copolymère éthylène-alpha-oléfine, sur la base de 100 parties en poids d'un matériau de base comprenant (A) 40 à 70 % en poids de résine polyamide et (B) 30 à 60 % en poids d'une charge inorganique comprenant des fibres de verre. (A) 폴리아미드 수지 40 내지 70 중량%; 및 (B) 유리섬유를 포함하는 무기 필러 30 내지 60 중량%을 포함하는 기초재료 100 중량부에 대해 (C) 폴리에테르-에스테르-아미드 블록 공중합체 3 내지 10 중량부; 및 (D) 에틸렌-알파-올레핀 공중합체 1 내지 10 중량부를 포함하는, 열가소성 수지 조성물이 제공된다.