SEMICONDUCTOR POWER MODULE AND METHOD AND TOOL FOR MANUFACTURING SUCH A MODULE

A semiconductor power module (10) comprising one or more semiconductors (4) placed on a substrate (7) is disclosed. The power module (10) comprises a contact formed from a contact pin (6) provided with a plastic sleeve (5) having a central portion (13). Therein the contact pin (6) comprises a longit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FILIPIAK-RESSEL, Tino, RUDZKI, Jacek, PAULSEN, Lars
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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