ELECTRONIC DEVICE AND ASSEMBLY METHOD THEREFOR
The present application provides an electronic device and an assembly method therefor. The electronic device comprises a middle frame, a bonding member, and a bending cover plate. The middle frame comprises a first assembly surface and a first outer surface connected to each other, and a step slot i...
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| Format: | Patent |
| Sprache: | chi ; eng ; fre |
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| Zusammenfassung: | The present application provides an electronic device and an assembly method therefor. The electronic device comprises a middle frame, a bonding member, and a bending cover plate. The middle frame comprises a first assembly surface and a first outer surface connected to each other, and a step slot is formed between the first assembly surface and the first outer surface; the bonding member is arranged in the step slot; and the bending cover plate comprises a body and a bending portion in bending connection with the periphery of the body, and a second assembly surface is formed at the end of the bending portion distant from the body. The first assembly surface and the second assembly surface are arranged opposite to each other, and the bonding connection between the first assembly surface and the second assembly surface is achieved by means of the bonding member; and a second outer surface of the bending cover plate, a third outer surface of the bonding member, and the first outer surface constitute a smooth su |
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