EDGE PROTECTION ON SEMICONDUCTOR SUBSTRATES

Exemplary methods of processing a semiconductor substrate may include forming a layer of dielectric material on the semiconductor substrate. The methods may include performing an edge exclusion removal of the layer of dielectric material. The methods may include forming a mask material on the semico...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHERWOOD, Tyler, AHN, Ki Cheol, CHEN, Xing, KRISHNAN, Siddarth, SALFELDER, Joseph F, YU, Lan, NOURBAKHSH, Amirhasan, FRONCKOWIAK, Michael Jason
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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