DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINABLE CIRCUITS

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINABLE CIRCUITS

Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOPKINS, Michael Adventure, CLARKE, Austin Michael, NELSON, Katherine M, KRUSKOPF, Mark S, RIVERA, Trevor Antonio, DESABATHINA, Sai Srinivas, CARBO, JR, KINZEL, Charles J, RONAY, Mark William, WALLANS, Michael Jasper, MARTINEZ, Jesse Michael, NEUMANN, Taylor V
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material. L'invention divulgue des dispositifs, des systèmes et des procédés de fabrication et d'utilisation d'ensembles de circuits hautement durables. Selon divers aspects, l'ensemble de circuits hautement durables comprend une couche de substrat ; et un motif de points de contact supportés par la couche de substrat. Le motif de points de contact peut être conçu pour correspondre à au moins une borne d'un composant électrique. Le motif de points de contact peut comprendre un matériau conducteur déformable. Le matériau conducteur déformable peut être un matériau non dangereux, facilement récupérable, facilement recyclable.