HOT MELT ADHESIVE COMPOSITION INCLUDING HIGH STYRENE CONTENT STYRENIC BLOCK COPOLYMER
A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55 % by weight styrene based on the weight of the styrenic block copolymer, at least 15 % by weight plasticizer, and from 30 % by weight to 70 % by weight of a tackifying agent. L'invention conce...
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| creator | KAUFFMAN, Thomas ZHOU, Haiying EVERSON, Daniel |
| description | A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55 % by weight styrene based on the weight of the styrenic block copolymer, at least 15 % by weight plasticizer, and from 30 % by weight to 70 % by weight of a tackifying agent.
L'invention concerne une composition d'adhésif thermofusible qui comprend un copolymère séquencé styrénique contenant plus de 55 % en poids de styrène sur la base du poids du copolymère séquencé styrénique, au moins 15 % en poids de plastifiant et de 30 % en poids à 70 % en poids d'un agent collant. |
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L'invention concerne une composition d'adhésif thermofusible qui comprend un copolymère séquencé styrénique contenant plus de 55 % en poids de styrène sur la base du poids du copolymère séquencé styrénique, au moins 15 % en poids de plastifiant et de 30 % en poids à 70 % en poids d'un agent collant.</description><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220901&DB=EPODOC&CC=WO&NR=2022183178A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220901&DB=EPODOC&CC=WO&NR=2022183178A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAUFFMAN, Thomas</creatorcontrib><creatorcontrib>ZHOU, Haiying</creatorcontrib><creatorcontrib>EVERSON, Daniel</creatorcontrib><title>HOT MELT ADHESIVE COMPOSITION INCLUDING HIGH STYRENE CONTENT STYRENIC BLOCK COPOLYMER</title><description>A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55 % by weight styrene based on the weight of the styrenic block copolymer, at least 15 % by weight plasticizer, and from 30 % by weight to 70 % by weight of a tackifying agent.
L'invention concerne une composition d'adhésif thermofusible qui comprend un copolymère séquencé styrénique contenant plus de 55 % en poids de styrène sur la base du poids du copolymère séquencé styrénique, au moins 15 % en poids de plastifiant et de 30 % en poids à 70 % en poids d'un agent collant.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAj18A9R8HX1CVFwdPFwDfYMc1Vw9vcN8A_2DPH091Pw9HP2CXXx9HNX8PB091AIDokMcvUDKfELcfULgfI9nRWcfPydvYHCAf4-kb6uQTwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JD7c38jAyMjQwtjQ3MLR0Jg4VQBRRDHC</recordid><startdate>20220901</startdate><enddate>20220901</enddate><creator>KAUFFMAN, Thomas</creator><creator>ZHOU, Haiying</creator><creator>EVERSON, Daniel</creator><scope>EVB</scope></search><sort><creationdate>20220901</creationdate><title>HOT MELT ADHESIVE COMPOSITION INCLUDING HIGH STYRENE CONTENT STYRENIC BLOCK COPOLYMER</title><author>KAUFFMAN, Thomas ; ZHOU, Haiying ; EVERSON, Daniel</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022183178A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAUFFMAN, Thomas</creatorcontrib><creatorcontrib>ZHOU, Haiying</creatorcontrib><creatorcontrib>EVERSON, Daniel</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAUFFMAN, Thomas</au><au>ZHOU, Haiying</au><au>EVERSON, Daniel</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HOT MELT ADHESIVE COMPOSITION INCLUDING HIGH STYRENE CONTENT STYRENIC BLOCK COPOLYMER</title><date>2022-09-01</date><risdate>2022</risdate><abstract>A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55 % by weight styrene based on the weight of the styrenic block copolymer, at least 15 % by weight plasticizer, and from 30 % by weight to 70 % by weight of a tackifying agent.
L'invention concerne une composition d'adhésif thermofusible qui comprend un copolymère séquencé styrénique contenant plus de 55 % en poids de styrène sur la base du poids du copolymère séquencé styrénique, au moins 15 % en poids de plastifiant et de 30 % en poids à 70 % en poids d'un agent collant.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | HOT MELT ADHESIVE COMPOSITION INCLUDING HIGH STYRENE CONTENT STYRENIC BLOCK COPOLYMER |
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