HOT MELT ADHESIVE COMPOSITION INCLUDING HIGH STYRENE CONTENT STYRENIC BLOCK COPOLYMER

A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55 % by weight styrene based on the weight of the styrenic block copolymer, at least 15 % by weight plasticizer, and from 30 % by weight to 70 % by weight of a tackifying agent. L'invention conce...

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Bibliographische Detailangaben
Hauptverfasser: KAUFFMAN, Thomas, ZHOU, Haiying, EVERSON, Daniel
Format: Patent
Sprache:eng ; fre
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Zusammenfassung:A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55 % by weight styrene based on the weight of the styrenic block copolymer, at least 15 % by weight plasticizer, and from 30 % by weight to 70 % by weight of a tackifying agent. L'invention concerne une composition d'adhésif thermofusible qui comprend un copolymère séquencé styrénique contenant plus de 55 % en poids de styrène sur la base du poids du copolymère séquencé styrénique, au moins 15 % en poids de plastifiant et de 30 % en poids à 70 % en poids d'un agent collant.