PHOTOSENSITIVE RESIN COMPOSITION
A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, wherein the alkali-soluble resin includes at least one selected from polyamide resins, polyimide resins, and pr...
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| creator | HORII Makoto TAKADA Wataru HIROSAWA Ryuji SUZUKI Sakiko |
| description | A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, wherein the alkali-soluble resin includes at least one selected from polyamide resins, polyimide resins, and precursors of these, the second organic solvent includes a heterocyclic compound having a carbonyl group (however, excluding N-methyl-2-pyrrolidone), and the amount of the second organic solvent is 0.001-4.0 mass% (inclusive) relative to the photosensitive resin composition as a whole.
L'invention concerne une composition de résine photosensible comprenant une résine alcalino-soluble, un photogénérateur d'acide, un premier solvant organique et un second solvant organique différent du premier solvant organique, la résine alcalino-soluble comprenant au moins un élément choisi parmi les résines de polyamide, les résines de polyimide et des précurseurs de celles-ci, le second solvant organique comprenant un composé hétérocyclique ayant un groupe carbonyle (cependant, à l'exclusion de la N-méthyl-2-pyrrolidone), et la quantité du second solvant organique étant de 0,001 à 4,0 % en masse (inclus) par rapport à la composition de résine photosensible dans son ensemble.
アルカリ可溶性樹脂、光酸発生剤、第一の有機溶剤、および前記第一の有機溶剤とは異なる第二の有機溶剤、を含む、感光性樹脂組成物であって、前記アルカリ可溶性樹脂が、ポリアミド樹脂、ポリイミド樹脂、およびそれらの前駆体から選択される少なくとも１つを含み、前記第二の有機溶剤が、カルボニル基を有する複素環化合物（ただし、Ｎ－メチル－２－ピロリドンを除く）を含み、前記第二の有機溶剤が、当該感光性樹脂組成物全体に対して、０．００１質量％以上４．０質量％以下の量である、感光性樹脂組成物。 |
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L'invention concerne une composition de résine photosensible comprenant une résine alcalino-soluble, un photogénérateur d'acide, un premier solvant organique et un second solvant organique différent du premier solvant organique, la résine alcalino-soluble comprenant au moins un élément choisi parmi les résines de polyamide, les résines de polyimide et des précurseurs de celles-ci, le second solvant organique comprenant un composé hétérocyclique ayant un groupe carbonyle (cependant, à l'exclusion de la N-méthyl-2-pyrrolidone), et la quantité du second solvant organique étant de 0,001 à 4,0 % en masse (inclus) par rapport à la composition de résine photosensible dans son ensemble.
アルカリ可溶性樹脂、光酸発生剤、第一の有機溶剤、および前記第一の有機溶剤とは異なる第二の有機溶剤、を含む、感光性樹脂組成物であって、前記アルカリ可溶性樹脂が、ポリアミド樹脂、ポリイミド樹脂、およびそれらの前駆体から選択される少なくとも１つを含み、前記第二の有機溶剤が、カルボニル基を有する複素環化合物（ただし、Ｎ－メチル－２－ピロリドンを除く）を含み、前記第二の有機溶剤が、当該感光性樹脂組成物全体に対して、０．００１質量％以上４．０質量％以下の量である、感光性樹脂組成物。</description><language>eng ; fre ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220818&DB=EPODOC&CC=WO&NR=2022172913A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220818&DB=EPODOC&CC=WO&NR=2022172913A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HORII Makoto</creatorcontrib><creatorcontrib>TAKADA Wataru</creatorcontrib><creatorcontrib>HIROSAWA Ryuji</creatorcontrib><creatorcontrib>SUZUKI Sakiko</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION</title><description>A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, wherein the alkali-soluble resin includes at least one selected from polyamide resins, polyimide resins, and precursors of these, the second organic solvent includes a heterocyclic compound having a carbonyl group (however, excluding N-methyl-2-pyrrolidone), and the amount of the second organic solvent is 0.001-4.0 mass% (inclusive) relative to the photosensitive resin composition as a whole.
L'invention concerne une composition de résine photosensible comprenant une résine alcalino-soluble, un photogénérateur d'acide, un premier solvant organique et un second solvant organique différent du premier solvant organique, la résine alcalino-soluble comprenant au moins un élément choisi parmi les résines de polyamide, les résines de polyimide et des précurseurs de celles-ci, le second solvant organique comprenant un composé hétérocyclique ayant un groupe carbonyle (cependant, à l'exclusion de la N-méthyl-2-pyrrolidone), et la quantité du second solvant organique étant de 0,001 à 4,0 % en masse (inclus) par rapport à la composition de résine photosensible dans son ensemble.
アルカリ可溶性樹脂、光酸発生剤、第一の有機溶剤、および前記第一の有機溶剤とは異なる第二の有機溶剤、を含む、感光性樹脂組成物であって、前記アルカリ可溶性樹脂が、ポリアミド樹脂、ポリイミド樹脂、およびそれらの前駆体から選択される少なくとも１つを含み、前記第二の有機溶剤が、カルボニル基を有する複素環化合物（ただし、Ｎ－メチル－２－ピロリドンを除く）を含み、前記第二の有機溶剤が、当該感光性樹脂組成物全体に対して、０．００１質量％以上４．０質量％以下の量である、感光性樹脂組成物。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAI8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvxMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jAyMjQ3MjS0NjR0Nj4lQBALKgI0o</recordid><startdate>20220818</startdate><enddate>20220818</enddate><creator>HORII Makoto</creator><creator>TAKADA Wataru</creator><creator>HIROSAWA Ryuji</creator><creator>SUZUKI Sakiko</creator><scope>EVB</scope></search><sort><creationdate>20220818</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION</title><author>HORII Makoto ; TAKADA Wataru ; HIROSAWA Ryuji ; SUZUKI Sakiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022172913A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2022</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HORII Makoto</creatorcontrib><creatorcontrib>TAKADA Wataru</creatorcontrib><creatorcontrib>HIROSAWA Ryuji</creatorcontrib><creatorcontrib>SUZUKI Sakiko</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORII Makoto</au><au>TAKADA Wataru</au><au>HIROSAWA Ryuji</au><au>SUZUKI Sakiko</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION</title><date>2022-08-18</date><risdate>2022</risdate><abstract>A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, wherein the alkali-soluble resin includes at least one selected from polyamide resins, polyimide resins, and precursors of these, the second organic solvent includes a heterocyclic compound having a carbonyl group (however, excluding N-methyl-2-pyrrolidone), and the amount of the second organic solvent is 0.001-4.0 mass% (inclusive) relative to the photosensitive resin composition as a whole.
L'invention concerne une composition de résine photosensible comprenant une résine alcalino-soluble, un photogénérateur d'acide, un premier solvant organique et un second solvant organique différent du premier solvant organique, la résine alcalino-soluble comprenant au moins un élément choisi parmi les résines de polyamide, les résines de polyimide et des précurseurs de celles-ci, le second solvant organique comprenant un composé hétérocyclique ayant un groupe carbonyle (cependant, à l'exclusion de la N-méthyl-2-pyrrolidone), et la quantité du second solvant organique étant de 0,001 à 4,0 % en masse (inclus) par rapport à la composition de résine photosensible dans son ensemble.
アルカリ可溶性樹脂、光酸発生剤、第一の有機溶剤、および前記第一の有機溶剤とは異なる第二の有機溶剤、を含む、感光性樹脂組成物であって、前記アルカリ可溶性樹脂が、ポリアミド樹脂、ポリイミド樹脂、およびそれらの前駆体から選択される少なくとも１つを含み、前記第二の有機溶剤が、カルボニル基を有する複素環化合物（ただし、Ｎ－メチル－２－ピロリドンを除く）を含み、前記第二の有機溶剤が、当該感光性樹脂組成物全体に対して、０．００１質量％以上４．０質量％以下の量である、感光性樹脂組成物。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | PHOTOSENSITIVE RESIN COMPOSITION |
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