LIGHTWEIGHT MULTILAYER SUBSTRATES
A lightweight multilayer substrate comprising a thermally compressed nonwoven core having a first surface and an opposed second surface, at least one top layer adhered to the first surface of the thermally compressed nonwoven core, and, optionally, at least one bottom layer adhered to the opposed se...
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| Format: | Patent |
| Sprache: | eng ; fre |
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| Zusammenfassung: | A lightweight multilayer substrate comprising a thermally compressed nonwoven core having a first surface and an opposed second surface, at least one top layer adhered to the first surface of the thermally compressed nonwoven core, and, optionally, at least one bottom layer adhered to the opposed second surface of the thermally compressed nonwoven core. The lightweight multilayer substrate has a specific modulus greater than 1200 (MPa/(g/cm3)) and a thermal expansion coefficient of less than 3 x 10"5 m/(m*°C). The lightweight multilayer substrate is thermally balanced between 25 °C and 70 °C.
L'invention concerne un substrat multicouches léger comprenant une âme non tissée thermiquement comprimée ayant une première surface et une seconde surface opposée, au moins une couche supérieure collée à la première surface de l'âme non tissée thermiquement comprimée et, facultativement, au moins une couche inférieure collée à la seconde surface opposée de l'âme non tissée thermiquement comprimée. Le substrat multicouches léger a un module spécifique supérieur à 1200 (MPa/(g/cm3)) et un coefficient de dilatation thermique inférieur à 3 x 10"5 m/ (m*°C). Le substrat multicouches léger est thermiquement équilibré entre 25 °C et 70° C. |
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