MEASURING APPARATUS AND MEASURING METHOD

A measuring apparatus (1) is provided with a support stand (203) for mounting a printed wiring board (102), a load application device (201) for applying a load to the printed wiring board (102) mounted on the support stand, a presser (202) for pressing the printed wiring board (102) by means of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UEHARA, Koki, NOTSU, Yukinari, YAMAGAMI, Taiju
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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