MULTILAYER ELECTRONIC SUBSTRATE

Provided is a multilayer electronic substrate that is made compact and thin while reducing stress on the connectors. The multilayer electronic substrate is provided with a first substrate, a second substrate arranged on the first substrate such that the surfaces thereof face each other, a first conn...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIROTA Kanahiro, HIRANO Keiichi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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