SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

A surface-treated copper foil according to exemplary embodiments comprises a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed in the protrusion layer or around the boundary between the copper foil layer and the protrusion layer. Abnormal growt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KYUN, Myung Ok, RYU, Ji Yeon, YOO, Il Hwan, JUNG, Joo Young, OH, Seung Bae
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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