SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

A surface-treated copper foil according to exemplary embodiments comprises a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed in the protrusion layer or around the boundary between the copper foil layer and the protrusion layer. Abnormal growt...

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Bibliographische Detailangaben
Hauptverfasser:	KYUN, Myung Ok, RYU, Ji Yeon, YOO, Il Hwan, JUNG, Joo Young, OH, Seung Bae
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A surface-treated copper foil according to exemplary embodiments comprises a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed in the protrusion layer or around the boundary between the copper foil layer and the protrusion layer. Abnormal growth of protrusions can be prevented through the pores and thus the bonding strength with an insulating layer can be enhanced. Une feuille de cuivre traitée en surface selon des exemples de modes de réalisation comprend une couche de feuille de cuivre et une couche de protubérances formée sur une surface de la couche de feuille de cuivre. Des pores sont formés dans la couche de protubérances ou autour de la limite entre la couche de feuille de cuivre et la couche de protubérances. Une croissance anormale des protubérances peut être empêchée à travers les pores et, par conséquent, la force de liaison avec une couche isolante peut être améliorée. 예시적인 실시예들에 따른 표면 처리 동박은 동박층 및 동박층의 일 면 상에 형성된 돌기층을 포함한다. 돌기층 내부 또는 동박층 및 상기 돌기층의 경계 주변에 형성된 기공들이 형성된다. 기공들을 통해 돌기의 이상 성장을 방지하며 절연층과의 접합력을 향상시킬 수 있다.