FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME

Disclosed is a film-like adhesive agent. One mode of the film-like adhesive agent contains metal particles and has a shear viscosity of 30,000 Pa*s or less at 110°C. Another mode of the film-like adhesive agent contains metal particles and has a loss modulus of 200 kPa or less at 110°C. Another mode...

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Bibliographische Detailangaben
Hauptverfasser:	KURODA Takahiro, HIRAMOTO Yuya, AKIYAMA Yuya, TANIGUCHI Kohei, KAMONO Megumi, ITAGAKI Kei
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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