TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component withi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIGBY, Arthur, BUSBY, James, LEWISON, David, ZHANG, Hongqing, CAMPBELL, Levi, BUCHLING, Philipp, BUNT, Jay
Format:	Patent
Sprache:	eng ; fre
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!