METHOD FOR PRODUCING PRINTED WIRING BOARD
According to the present invention, when a printed wiring board is produced by a semi-additive method, a used remover liquid after usage for removal of a nickel/chromium-containing layer (5) is regenerated by being brought into contact with a chelating resin that has a functional group represented b...
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| creator | FUKUI, Yu NISHIE, Kenji NITTA, Koji YAMAGUCHI, Yoshihito YASUDA, Masaharu KASUYA, Koji SAKAI, Shoichiro OHSUKA, Ryuta TSUCHIKO, Akira |
| description | According to the present invention, when a printed wiring board is produced by a semi-additive method, a used remover liquid after usage for removal of a nickel/chromium-containing layer (5) is regenerated by being brought into contact with a chelating resin that has a functional group represented by formula (1). In formula (1), a plurality of R moieties represent a same divalent hydrocarbon group having from 1 to 5 carbon atoms; and some of the hydrogen atoms may be substituted by halogen atoms.
Selon la présente invention, lorsqu'une carte de circuit imprimé est produite par un procédé semi-additif, un liquide décapant usagé après son utilisation pour l'élimination d'une couche contenant du nickel/chrome (5) est régénéré par la mise en contact avec une résine chélatante qui a un groupe fonctionnel représenté par la formule (1). Dans la formule (1), une pluralité de R fractions représentent un même groupe hydrocarboné divalent ayant de 1 à 5 atomes de carbone ; et certains des atomes d'hydrogène peuvent être substitués par des atomes d'halogène.
セミアディティブ法によるプリント配線板の製造において、ニッケルクロム含有層（５）の除去に用いられた使用済みの除去液を、下記式（１）で表される官能基を有するキレート樹脂と接触させて再生する。 式（１）中、複数のＲは、同一の炭素数１～５の２価の炭化水素基であり、水素原子の一部はハロゲン原子で置換されていてもよい。 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2022113831A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2022113831A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2022113831A13</originalsourceid><addsrcrecordid>eNrjZND0dQ3x8HdRcPMPUggI8ncJdfb0cweyPP1CXF0Uwj2DQFwnf8cgFx4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh_ub2RgZGRoaGxhbOhoaEycKgC5XiUv</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING PRINTED WIRING BOARD</title><source>esp@cenet</source><creator>FUKUI, Yu ; NISHIE, Kenji ; NITTA, Koji ; YAMAGUCHI, Yoshihito ; YASUDA, Masaharu ; KASUYA, Koji ; SAKAI, Shoichiro ; OHSUKA, Ryuta ; TSUCHIKO, Akira</creator><creatorcontrib>FUKUI, Yu ; NISHIE, Kenji ; NITTA, Koji ; YAMAGUCHI, Yoshihito ; YASUDA, Masaharu ; KASUYA, Koji ; SAKAI, Shoichiro ; OHSUKA, Ryuta ; TSUCHIKO, Akira</creatorcontrib><description>According to the present invention, when a printed wiring board is produced by a semi-additive method, a used remover liquid after usage for removal of a nickel/chromium-containing layer (5) is regenerated by being brought into contact with a chelating resin that has a functional group represented by formula (1). In formula (1), a plurality of R moieties represent a same divalent hydrocarbon group having from 1 to 5 carbon atoms; and some of the hydrogen atoms may be substituted by halogen atoms.
Selon la présente invention, lorsqu'une carte de circuit imprimé est produite par un procédé semi-additif, un liquide décapant usagé après son utilisation pour l'élimination d'une couche contenant du nickel/chrome (5) est régénéré par la mise en contact avec une résine chélatante qui a un groupe fonctionnel représenté par la formule (1). Dans la formule (1), une pluralité de R fractions représentent un même groupe hydrocarboné divalent ayant de 1 à 5 atomes de carbone ; et certains des atomes d'hydrogène peuvent être substitués par des atomes d'halogène.
セミアディティブ法によるプリント配線板の製造において、ニッケルクロム含有層（５）の除去に用いられた使用済みの除去液を、下記式（１）で表される官能基を有するキレート樹脂と接触させて再生する。 式（１）中、複数のＲは、同一の炭素数１～５の２価の炭化水素基であり、水素原子の一部はハロゲン原子で置換されていてもよい。</description><language>eng ; fre ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220602&DB=EPODOC&CC=WO&NR=2022113831A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220602&DB=EPODOC&CC=WO&NR=2022113831A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUI, Yu</creatorcontrib><creatorcontrib>NISHIE, Kenji</creatorcontrib><creatorcontrib>NITTA, Koji</creatorcontrib><creatorcontrib>YAMAGUCHI, Yoshihito</creatorcontrib><creatorcontrib>YASUDA, Masaharu</creatorcontrib><creatorcontrib>KASUYA, Koji</creatorcontrib><creatorcontrib>SAKAI, Shoichiro</creatorcontrib><creatorcontrib>OHSUKA, Ryuta</creatorcontrib><creatorcontrib>TSUCHIKO, Akira</creatorcontrib><title>METHOD FOR PRODUCING PRINTED WIRING BOARD</title><description>According to the present invention, when a printed wiring board is produced by a semi-additive method, a used remover liquid after usage for removal of a nickel/chromium-containing layer (5) is regenerated by being brought into contact with a chelating resin that has a functional group represented by formula (1). In formula (1), a plurality of R moieties represent a same divalent hydrocarbon group having from 1 to 5 carbon atoms; and some of the hydrogen atoms may be substituted by halogen atoms.
Selon la présente invention, lorsqu'une carte de circuit imprimé est produite par un procédé semi-additif, un liquide décapant usagé après son utilisation pour l'élimination d'une couche contenant du nickel/chrome (5) est régénéré par la mise en contact avec une résine chélatante qui a un groupe fonctionnel représenté par la formule (1). Dans la formule (1), une pluralité de R fractions représentent un même groupe hydrocarboné divalent ayant de 1 à 5 atomes de carbone ; et certains des atomes d'hydrogène peuvent être substitués par des atomes d'halogène.
セミアディティブ法によるプリント配線板の製造において、ニッケルクロム含有層（５）の除去に用いられた使用済みの除去液を、下記式（１）で表される官能基を有するキレート樹脂と接触させて再生する。 式（１）中、複数のＲは、同一の炭素数１～５の２価の炭化水素基であり、水素原子の一部はハロゲン原子で置換されていてもよい。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0dQ3x8HdRcPMPUggI8ncJdfb0cweyPP1CXF0Uwj2DQFwnf8cgFx4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh_ub2RgZGRoaGxhbOhoaEycKgC5XiUv</recordid><startdate>20220602</startdate><enddate>20220602</enddate><creator>FUKUI, Yu</creator><creator>NISHIE, Kenji</creator><creator>NITTA, Koji</creator><creator>YAMAGUCHI, Yoshihito</creator><creator>YASUDA, Masaharu</creator><creator>KASUYA, Koji</creator><creator>SAKAI, Shoichiro</creator><creator>OHSUKA, Ryuta</creator><creator>TSUCHIKO, Akira</creator><scope>EVB</scope></search><sort><creationdate>20220602</creationdate><title>METHOD FOR PRODUCING PRINTED WIRING BOARD</title><author>FUKUI, Yu ; NISHIE, Kenji ; NITTA, Koji ; YAMAGUCHI, Yoshihito ; YASUDA, Masaharu ; KASUYA, Koji ; SAKAI, Shoichiro ; OHSUKA, Ryuta ; TSUCHIKO, Akira</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022113831A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUI, Yu</creatorcontrib><creatorcontrib>NISHIE, Kenji</creatorcontrib><creatorcontrib>NITTA, Koji</creatorcontrib><creatorcontrib>YAMAGUCHI, Yoshihito</creatorcontrib><creatorcontrib>YASUDA, Masaharu</creatorcontrib><creatorcontrib>KASUYA, Koji</creatorcontrib><creatorcontrib>SAKAI, Shoichiro</creatorcontrib><creatorcontrib>OHSUKA, Ryuta</creatorcontrib><creatorcontrib>TSUCHIKO, Akira</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUI, Yu</au><au>NISHIE, Kenji</au><au>NITTA, Koji</au><au>YAMAGUCHI, Yoshihito</au><au>YASUDA, Masaharu</au><au>KASUYA, Koji</au><au>SAKAI, Shoichiro</au><au>OHSUKA, Ryuta</au><au>TSUCHIKO, Akira</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING PRINTED WIRING BOARD</title><date>2022-06-02</date><risdate>2022</risdate><abstract>According to the present invention, when a printed wiring board is produced by a semi-additive method, a used remover liquid after usage for removal of a nickel/chromium-containing layer (5) is regenerated by being brought into contact with a chelating resin that has a functional group represented by formula (1). In formula (1), a plurality of R moieties represent a same divalent hydrocarbon group having from 1 to 5 carbon atoms; and some of the hydrogen atoms may be substituted by halogen atoms.
Selon la présente invention, lorsqu'une carte de circuit imprimé est produite par un procédé semi-additif, un liquide décapant usagé après son utilisation pour l'élimination d'une couche contenant du nickel/chrome (5) est régénéré par la mise en contact avec une résine chélatante qui a un groupe fonctionnel représenté par la formule (1). Dans la formule (1), une pluralité de R fractions représentent un même groupe hydrocarboné divalent ayant de 1 à 5 atomes de carbone ; et certains des atomes d'hydrogène peuvent être substitués par des atomes d'halogène.
セミアディティブ法によるプリント配線板の製造において、ニッケルクロム含有層（５）の除去に用いられた使用済みの除去液を、下記式（１）で表される官能基を有するキレート樹脂と接触させて再生する。 式（１）中、複数のＲは、同一の炭素数１～５の２価の炭化水素基であり、水素原子の一部はハロゲン原子で置換されていてもよい。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS |
| title | METHOD FOR PRODUCING PRINTED WIRING BOARD |
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