ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Disclosed in the embodiments of the present application are an electronic component and an electronic device, which realize a three-dimensional stacked structure, achieve area reduction, and improve heat dissipation. According to the embodiments of the present application, the electronic component c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MO, Ruiming, YANG, Xichen, SUN, Jie, XU, Yi
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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