ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Disclosed in the embodiments of the present application are an electronic component and an electronic device, which realize a three-dimensional stacked structure, achieve area reduction, and improve heat dissipation. According to the embodiments of the present application, the electronic component comprises an upper cover plate, a lower cover plate and an enclosure frame, wherein the upper cover plate carries a first circuit; the lower cover plate carries a second circuit; the enclosure frame is connected to the upper cover plate and the lower cover plate; an interconnection circuit is provided in the enclosure frame; the interconnection circuit is used to implement interconnection between the first circuit and the second circuit; and the first circuit and the second circuit are overlapped in the vertical direction under the condition that the first circuit and the second circuit do not interfere with each other. Since the height of the enclosure frame is not lower than a preset height that is greater than th