PROTECTIVE TAPES, ARTICLES THEREFROM, AND METHODS OF MAKING AND USING SAME

An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer born...

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Bibliographische Detailangaben
Hauptverfasser:	LIU, Richard Y, CHEN, Yaoyao, WANG, Shujun J, GRISLE, Roger A, GORRELL, Robin E
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent. Un article comprend un substrat ayant une surface de formation de circuit et une surface de formation de non-circuit à l'opposé de la surface de formation de circuit. L'article comprend en outre une bande protectrice portée sur la surface de formation de circuit. La bande de protection comprend une couche de support et une couche adhésive durcissable portée sur une surface principale de la couche de support. La couche adhésive durcissable comprend un élastomère de caoutchouc et un agent de durcissement thermique.