METHODS FOR DEPOSITING PIEZOELECTRIC MATERIALS, AND MATERIALS DEPOSITED THEREWITH

Methods of depositing material onto substrate comprising: depositing a first seed material onto a wafer substrate, the wafer substrate having a face that defines a normal to the substrate, wherein the first seed material is deposited at a pressure of 10 to 20 mTorr to form a pre-seed layer on the wa...

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Bibliographische Detailangaben

Hauptverfasser:	BELSICK, John, WASILIK, Matthew, DIEP, Buu Quoc, DENIZ, Derya
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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