LINERLESS FILM STACK

A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler ma...

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Bibliographische Detailangaben
Hauptverfasser:	NIELSEN, John A, TAI, Huiwen
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler manufacturing, and a thinner overall construction versus conventional film stacks. L'invention concerne un empilement de films. En particulier, l'invention concerne un empilement de films qui comprend un premier substrat de base co-extrudable, un premier adhésif sensible à la pression, une couche de libération, un second adhésif sensible à la pression et un second substrat de base. De tels empilements de films peuvent bénéficier de déchets réduits, d'une fabrication plus simple, et d'une construction globale plus mince par rapport aux empilements de films classiques.