CATHODE ASSEMBLY, DEPOSITION APPARATUS AND METHOD FOR SPUTTER DEPOSITION

A cathode assembly (110) for sputter deposition is provided. The cathode assembly includes a first cathode drive unit (113) configured to rotate a first rotatable cathode (111), a second cathode drive unit (114) adjacent to the first cathode drive unit configured to rotate a second rotatable cathode...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HELLMICH, Anke, HINTERSCHUSTER, Reiner
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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