METHOD FOR PRODUCING OVERLAY RESULTS WITH ABSOLUTE REFERENCE FOR SEMICONDUCTOR MANUFACTURING
A method of processing a wafer is provided. The method includes providing a reference pattern for patterning a wafer. The reference pattern is independent of a working surface of the wafer. A placement of a first pattern on the working surface of the wafer is determined by identifying the reference...
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Format: | Patent |
Sprache: | eng ; fre |
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