METHOD FOR PRODUCING OVERLAY RESULTS WITH ABSOLUTE REFERENCE FOR SEMICONDUCTOR MANUFACTURING

A method of processing a wafer is provided. The method includes providing a reference pattern for patterning a wafer. The reference pattern is independent of a working surface of the wafer. A placement of a first pattern on the working surface of the wafer is determined by identifying the reference...

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Bibliographische Detailangaben
1. Verfasser: DEVILLIERS, Anton J
Format: Patent
Sprache:eng ; fre
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