METHOD FOR PRODUCING OVERLAY RESULTS WITH ABSOLUTE REFERENCE FOR SEMICONDUCTOR MANUFACTURING

A method of processing a wafer is provided. The method includes providing a reference pattern for patterning a wafer. The reference pattern is independent of a working surface of the wafer. A placement of a first pattern on the working surface of the wafer is determined by identifying the reference...

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Bibliographische Detailangaben
1. Verfasser:	DEVILLIERS, Anton J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of processing a wafer is provided. The method includes providing a reference pattern for patterning a wafer. The reference pattern is independent of a working surface of the wafer. A placement of a first pattern on the working surface of the wafer is determined by identifying the reference pattern to align the first pattern. The first pattern is formed on the working surface of the wafer based on the placement. L'invention concerne un procédé de traitement de tranche. Le procédé consiste à fournir un motif de référence servant à former un motif sur une tranche. Le motif de référence est indépendant d'une surface de travail de la tranche. Un placement d'un premier motif sur la surface de travail de la tranche est déterminé en identifiant le motif de référence pour aligner le premier motif. Le premier motif est formé sur la surface de travail de la tranche sur la base du placement.