EPOXY RESIN COMPOSITION, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING SAME

The present invention addresses the problem of providing an epoxy resin composition which has an extremely low viscosity and excellent impregnation properties, is resistant to an increase in viscosity at an injection temperature, is stable, can be sufficiently cured in a short time and, when subject...

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Bibliographische Detailangaben
Hauptverfasser:	TOMIOKA, Nobuyuki, KOYANAGI, Shizue, MATSUKAWA, Ko, HAYASHI, Shinya
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing an epoxy resin composition which has an extremely low viscosity and excellent impregnation properties, is resistant to an increase in viscosity at an injection temperature, is stable, can be sufficiently cured in a short time and, when subjected to a demolding process after being molded, a resin is sufficiently cured and imparted with high heat resistance, thereby enabling smooth demolding. The present invention also addresses the problem of providing a fiber-reinforced composite material having excellent compressive strength and microcrack resistance under conditions of wet heat.　This epoxy resin composition contains at least constituent components [A] to [C] as epoxy resins and contains at least a constituent component [D] and a constituent component [E] as curing agents. Constituent component [A] is contained at a quantity of 30-50 parts by mass relative to 100 parts by mass of all epoxy resin components. Constituent component [B] is contained at a quantity of 20-40 parts by mass relative to 100 parts by mass of all epoxy resin components. Constituent component [D] is contained at a quantity of 55-75 parts by mass relative to 100 parts by mass of all curing agent components. The ratio (H/E) of the total number of epoxy groups (E) contained in the epoxy resins and the total number of active hydrogens (H) in the amine compounds contained in the curing agents is 1.1-1.4. [A] A tetrafunctional glycidyldiamine type epoxy resin [B] An aminophenol type epoxy resin [C] A bisphenol F type epoxy resin [D] A crystalline aromatic diamine [E] A liquid aromatic diamine La présente invention aborde le problème de la fourniture d'une composition de résine époxy qui a une viscosité extrêmement faible et d'excellentes propriétés d'imprégnation, est résistante à une augmentation de la viscosité à une température d'injection, est stable, peut être suffisamment durcie en un temps court et, lorsqu'elle est soumise à un procédé de démoulage après avoir été moulée, une résine est suffisamment durcie et dotée d'une résistance élevée à la chaleur, ce qui permet un démoulage doux. La présente invention aborde également le problème de la fourniture d'un matériau composite renforcé par des fibres ayant une excellente résistance à la compression et une excellente résistance à la microfissuration dans des conditions de chaleur humide.　Cette composition de résine époxy contient au moins des composants constitutifs [A] à [C] en t